BOND TECHNOLOGY INTERNATIONAL PTE LTD

BOND TECHNOLOGY INTERNATIONAL PTE LTD (Registration Number: 199101344C) was incorporated on 1991-03-26 in Singapore. Their business is recorded as EXEMPT PRIVATE COMPANY LIMITED BY SHARES. The Company's current operating status is Struck Off

Company Info
Unique Entity Number:
199101344C
Current Entity Name:
BOND TECHNOLOGY INTERNATIONAL PTE LTD
Registration Date:
Company Status:
Struck Off
Business Type:
EXEMPT PRIVATE COMPANY LIMITED BY SHARES
Primary Business Activity:
Ssic Code:26201 MANUFACTURE OF COMPUTERS AND DATA PROCESSING EQUIPMENT EXCEPT COMPUTER PERIPHERAL EQUIPMENT
Secondary Business Activity:
Ssic Code:26209 MANUFACTURE OF COMPUTERS AND PERIPHERAL EQUIPMENT N.E.C.
Added: Updated:
Principal Office Address
Main Address:
23 PECK SEAH STREET #02-112, , Singapore, 079313
Name History
No Data
« ZHENG YI SHIPPING PTE LTD SENTRY INDUSTRIES SINGAPORE PTE LTD »
Comments

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Registered on 1991-03-26
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