TECHNOFORM EDGE BOND SOLUTIONS SINGAPORE PTE. LTD.

TECHNOFORM EDGE BOND SOLUTIONS SINGAPORE PTE. LTD. (Registration Number: 201836279C) was incorporated on 2018-10-24 in Singapore. Their business is recorded as PRIVATE COMPANY LIMITED BY SHARES. The Company's current operating status is Live Company

Company Info
Unique Entity Number:
201836279C
Current Entity Name:
Registration Date:
Company Status:
Live Company
Business Type:
PRIVATE COMPANY LIMITED BY SHARES
Primary Business Activity:
Ssic Code:22219 MANUFACTURE OF PLASTIC PRODUCTS N.E.C. (EXCEPT PLASTIC FOOTWEAR AND TOYS)
Secondary Business Activity:
Ssic Code:46900 WHOLESALE TRADE OF A VARIETY OF GOODS WITHOUT A DOMINANT PRODUCT
Principal Office Address
Main Address:
6 TEMASEK BOULEVARD #28-06, SUNTEC TOWER FOUR, Singapore, 038986
Name History
No Data
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