TECHNOFORM EDGE BOND SOLUTIONS SINGAPORE PTE. LTD.

TECHNOFORM EDGE BOND SOLUTIONS SINGAPORE PTE. LTD. (Registration Number: 201836279C) was incorporated on 2018-10-24 in Singapore. Their business is recorded as Private Company Limited by Shares. The Company's current operating status is Live Company

Company Info
Unique Entity Number:
201836279C
Current Entity Name:
TECHNOFORM EDGE BOND SOLUTIONS SINGAPORE PTE. LTD.
Registration Date:
Company Status:
Live Company
Business Type:
Private Company Limited by Shares
Primary Business Activity:
Ssic Code:22219 MFG. OF WARM EDGE SPACERS &THERMAL EDGE BOND SOLUTIONS FOR INSULATING GLASS
Secondary Business Activity:
Ssic Code:46900 MFG. OF WARM EDGE SPACERS &THERMAL EDGE BOND SOLUTIONS FOR INSULATING GLASS
Added: Updated:
Principal Office Address
Main Address:
6 TEMASEK BOULEVARD #28-06, SUNTEC TOWER FOUR, Singapore, 38986
Name History
No Data
« CURAM ASIA PTE. LTD. AVARIEL CONSULTANCY PTE. LTD. »
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Registered on 2018-10-24
ALTUM TECHNOLOGIES LLP Live
THE LITTLE LEARNING PLACE LLP Struck Off
FIRST HILLTOP LLP Struck Off
JUYUN LLP Live
T & A COLLECTION LLP Struck Off
JUSTRENTLAH LLP Live
HEALTH & DAILY FOODS LIMITED LIABILITY PARTNERSHIP Struck Off
ROSLIN TRANSPORT SERVICES Ceased Registration
KALAIMAGAL ARTS Live
TINKERSLAND Ceased Registration
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