TOPBOND TECHNOLOGY INTERNATIONAL PTE. LTD.

TOPBOND TECHNOLOGY INTERNATIONAL PTE. LTD. (Registration Number: 200715858K) was incorporated on 2007-08-28 in Singapore. Their business is recorded as EXEMPT PRIVATE COMPANY LIMITED BY SHARES. The Company's current operating status is Live Company

Company Info
Unique Entity Number:
200715858K
Current Entity Name:
TOPBOND TECHNOLOGY INTERNATIONAL PTE. LTD.
Registration Date:
Company Status:
Live Company
Business Type:
EXEMPT PRIVATE COMPANY LIMITED BY SHARES
Primary Business Activity:
Ssic Code:28273 MANUFACTURE AND REPAIR OF SEMICONDUCTOR ASSEMBLY AND TESTING EQUIPMENT (INCLUDING COMPUTER BURN-IN SYSTEM)
Secondary Business Activity:
Ssic Code:28274 MANUFACTURE AND REPAIR OF SEMICONDUCTOR FOUNDRY EQUIPMENT
Added: Updated:
Principal Office Address
Main Address:
5 SOON LEE STREET #05-35, PIONEER POINT, Singapore, 627607
Name History
No Data
« GEM DIAMONDS SINGAPORE PTE. LTD. SUBSPACE STUDIO PTE. LTD. »
Comments

This is not the official website of this company. Don't seek support service here please.

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Registered on 2007-08-28
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